PDS Planning Inc reduced its position in ASE Technology Holding Co., Ltd. (NYSE:ASX – Get Rating) by 38.0% in the second quarter, according to its most recent disclosure with the Securities and Exchange Commission (SEC). The fund owned 15,280 shares of the semiconductor company’s stock after selling 9,375 shares during the quarter. PDS Planning Inc’s holdings in ASE Technology were worth $79,000 as of its most recent filing with the Securities and Exchange Commission (SEC).
A number of other large investors have also bought and sold shares of ASX. EverSource Wealth Advisors LLC boosted its holdings in shares of ASE Technology by 299.4% in the first quarter. EverSource Wealth Advisors LLC now owns 4,992 shares of the semiconductor company’s stock worth $35,000 after acquiring an additional 3,742 shares during the period. Fieldpoint Private Securities LLC boosted its stake in ASE Technology by 137.7% during the first quarter. Fieldpoint Private Securities LLC now owns 6,239 shares of the semiconductor company’s stock valued at $44,000 after buying an additional 3,614 shares during the period. Cambridge Investment Research Advisors Inc. bought a new stake in ASE Technology during the second quarter valued at $55,000. Barings LLC bought a new stake in ASE Technology during the first quarter valued at $71,000. Finally, Ieq Capital LLC bought a new stake in ASE Technology during the first quarter valued at $81,000. 6.57% of the stock is owned by hedge funds and other institutional investors.
Wall Street Analysts Forecast Growth
Separately, StockNews.com lowered ASE Technology from a “buy” rating to a “hold” rating in a research note on Tuesday.
ASE Technology Trading Down 0.9 %
ASE Technology Profile
ASE Technology Holding Co, Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions.
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