BE Semiconductor Industries (OTCMKTS:BESIY) Sets New 52-Week High – What’s Next?

BE Semiconductor Industries NV (OTCMKTS:BESIY)’s share price reached a new 52-week high during mid-day trading on Saturday . The stock traded as high as $211.2450 and last traded at $210.00, with a volume of 12042 shares traded. The stock had previously closed at $201.12.

Analyst Ratings Changes

Several research firms recently weighed in on BESIY. Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 20th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. UBS Group reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, October 24th. Sanford C. Bernstein reiterated an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Finally, Kepler Capital Markets lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, January 9th. Five equities research analysts have rated the stock with a Buy rating and five have given a Hold rating to the stock. According to MarketBeat, BE Semiconductor Industries presently has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Price Performance

The company has a debt-to-equity ratio of 1.46, a current ratio of 5.75 and a quick ratio of 5.02. The firm has a market cap of $15.23 billion, a price-to-earnings ratio of 103.45 and a beta of 1.85. The business’s 50-day moving average price is $181.07 and its two-hundred day moving average price is $160.35.

About BE Semiconductor Industries

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.