BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Up – What’s Next?

Posted by Trevor Kearing on Mar 20th, 2026

BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price gapped up before the market opened on Wednesday . The stock had previously closed at $212.04, but opened at $219.6325. BE Semiconductor Industries shares last traded at $219.6325, with a volume of 448 shares trading hands.

Wall Street Analyst Weigh In

A number of research firms have recently commented on BESIY. Berenberg Bank raised shares of BE Semiconductor Industries to a “hold” rating in a research note on Monday, February 23rd. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 13th. Citigroup reiterated a “neutral” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 20th. Kepler Capital Markets lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, January 9th. Finally, Needham & Company LLC raised BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. Five analysts have rated the stock with a Buy rating and six have assigned a Hold rating to the company’s stock. According to MarketBeat, BE Semiconductor Industries presently has an average rating of “Hold”.

Check Out Our Latest Stock Analysis on BESIY

BE Semiconductor Industries Stock Performance

The firm has a fifty day simple moving average of $206.45 and a 200-day simple moving average of $173.09. The company has a quick ratio of 5.02, a current ratio of 5.55 and a debt-to-equity ratio of 1.22. The company has a market cap of $15.48 billion, a PE ratio of 114.20 and a beta of 1.81.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.