BE Semiconductor Industries NV (OTCMKTS:BESIY) Receives Consensus Rating of “Hold” from Brokerages

Posted by Patrick Bannon on Mar 21st, 2026

Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) have received a consensus recommendation of “Hold” from the eleven research firms that are currently covering the company, Marketbeat Ratings reports. Six analysts have rated the stock with a hold recommendation and five have issued a buy recommendation on the company.

A number of equities research analysts have recently issued reports on the company. Sanford C. Bernstein reiterated an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Kepler Capital Markets lowered shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, January 9th. Berenberg Bank raised shares of BE Semiconductor Industries to a “hold” rating in a research note on Monday, February 23rd. Finally, Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 20th.

Get Our Latest Analysis on BE Semiconductor Industries

BE Semiconductor Industries Stock Performance

Shares of OTCMKTS BESIY opened at $208.52 on Friday. BE Semiconductor Industries has a 1 year low of $88.02 and a 1 year high of $235.17. The company has a debt-to-equity ratio of 1.22, a quick ratio of 5.02 and a current ratio of 5.55. The company’s fifty day moving average price is $207.09 and its 200 day moving average price is $173.60. The company has a market capitalization of $15.12 billion, a PE ratio of 111.51 and a beta of 1.81.

BE Semiconductor Industries Company Profile

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BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.