BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) hit a new 52-week high during trading on Wednesday . The stock traded as high as $335.27 and last traded at $334.88, with a volume of 11606 shares traded. The stock had previously closed at $315.10.
Analyst Ratings Changes
BESIY has been the topic of several recent research reports. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a report on Friday, May 15th. Finally, Zacks Research raised BE Semiconductor Industries to a “strong-buy” rating in a research note on Thursday, April 23rd. One investment analyst has rated the stock with a Strong Buy rating, five have issued a Buy rating and four have given a Hold rating to the stock. According to MarketBeat.com, the stock has an average rating of “Moderate Buy”.
Read Our Latest Stock Report on BE Semiconductor Industries
BE Semiconductor Industries Trading Up 6.3%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last announced its quarterly earnings results on Thursday, April 23rd. The technology company reported $0.76 EPS for the quarter, meeting the consensus estimate of $0.76. The business had revenue of $216.51 million for the quarter, compared to analyst estimates of $220.77 million. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%. As a group, research analysts anticipate that BE Semiconductor Industries NV will post 4.46 EPS for the current year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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