Disco Corp (OTCMKTS:DSCSY) Sees Significant Drop in Short Interest

Disco Corp (OTCMKTS:DSCSY) saw a significant drop in short interest in the month of May. As of May 29th, there was short interest totaling 15,431 shares, a drop of 90.9% from the May 14th total of 168,911 shares. Based on an average trading volume of 522,973 shares, the days-to-cover ratio is presently 0.0 days. Currently, 0.0% of the shares of the stock are short sold.

Wall Street Analyst Weigh In

Separately, Zacks Research cut shares of Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One research analyst has rated the stock with a Strong Buy rating and one has assigned a Hold rating to the stock. According to data from MarketBeat, Disco presently has an average rating of “Buy”.

Disco Price Performance

DSCSY opened at $44.34 on Wednesday. Disco has a 1-year low of $22.92 and a 1-year high of $52.99. The stock has a market cap of $48.10 billion, a P/E ratio of 54.07 and a beta of 1.54. The stock’s 50 day simple moving average is $43.80 and its 200 day simple moving average is $40.41.

Disco (OTCMKTS:DSCSY) last issued its quarterly earnings data on Wednesday, April 22nd. The company reported $0.25 earnings per share (EPS) for the quarter. The firm had revenue of $848.13 million during the quarter, compared to analysts’ expectations of $771.53 million. Disco had a return on equity of 25.27% and a net margin of 30.95%. Research analysts expect that Disco will post 1.07 EPS for the current fiscal year.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.