Disco (OTCMKTS:DSCSY) Shares Gap Down – Here’s What Happened

Disco Corp (OTCMKTS:DSCSY) shares gapped down prior to trading on Tuesday . The stock had previously closed at $36.14, but opened at $34.25. Disco shares last traded at $34.26, with a volume of 5,348 shares changing hands.

Analyst Ratings Changes

DSCSY has been the topic of a number of research analyst reports. Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. Jefferies Financial Group raised shares of Disco from a “hold” rating to a “buy” rating in a research note on Monday, July 27th. One research analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the stock. According to MarketBeat, the company has a consensus rating of “Moderate Buy”.

Disco Stock Up 2.1%

The stock has a market capitalization of $37.84 billion, a P/E ratio of 40.08 and a beta of 1.54. The stock has a 50 day simple moving average of $40.62 and a two-hundred day simple moving average of $43.59.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. The firm had revenue of $717.28 million for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. Sell-side analysts predict that Disco Corp will post 1.05 earnings per share for the current fiscal year.

Hedge Funds Weigh In On Disco

A hedge fund recently bought a new stake in Disco stock. Azimuth Capital Investment Management LLC acquired a new position in shares of Disco Corp (OTCMKTS:DSCSY) in the 2nd quarter, according to its most recent 13F filing with the Securities and Exchange Commission (SEC). The firm acquired 237,250 shares of the company’s stock, valued at approximately $11,862,000. Hedge funds and other institutional investors own 0.03% of the company’s stock.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.