Disco Corp (OTCMKTS:DSCSY) Short Interest Up 747.0% in May

Disco Corp (OTCMKTS:DSCSY) saw a large increase in short interest in the month of May. As of May 15th, there was short interest totaling 168,911 shares, an increase of 747.0% from the April 30th total of 19,942 shares. Based on an average daily volume of 220,200 shares, the short-interest ratio is presently 0.8 days. Approximately 0.0% of the company’s shares are sold short.

Disco Stock Performance

Shares of DSCSY opened at $41.16 on Friday. The firm’s 50-day simple moving average is $43.65 and its two-hundred day simple moving average is $39.73. Disco has a fifty-two week low of $22.08 and a fifty-two week high of $52.99. The stock has a market cap of $44.65 billion, a PE ratio of 50.20 and a beta of 1.63.

Disco (OTCMKTS:DSCSY) last released its earnings results on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. Disco had a return on equity of 25.27% and a net margin of 30.95%.The business had revenue of $848.13 million for the quarter, compared to the consensus estimate of $771.53 million. Equities research analysts predict that Disco will post 1.07 EPS for the current year.

Wall Street Analyst Weigh In

Separately, Zacks Research downgraded Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One equities research analyst has rated the stock with a Strong Buy rating and one has given a Hold rating to the company’s stock. According to MarketBeat.com, the company currently has an average rating of “Buy”.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.