Disco (OTCMKTS:DSCSY) Shares Up 4.8% – Still a Buy?

Disco Corp (OTCMKTS:DSCSYGet Free Report) shares traded up 4.8% on Wednesday . The company traded as high as $44.35 and last traded at $43.04. 9,175 shares were traded during trading, a decline of 97% from the average session volume of 286,670 shares. The stock had previously closed at $41.07.

Wall Street Analyst Weigh In

Separately, Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One analyst has rated the stock with a Strong Buy rating and one has given a Hold rating to the stock. Based on data from MarketBeat.com, the stock presently has a consensus rating of “Buy”.

Check Out Our Latest Report on Disco

Disco Stock Up 4.7%

The business’s 50-day moving average is $43.59 and its two-hundred day moving average is $39.84. The stock has a market capitalization of $46.66 billion, a price-to-earnings ratio of 52.45 and a beta of 1.54.

Disco (OTCMKTS:DSCSYGet Free Report) last issued its earnings results on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The company had revenue of $848.13 million for the quarter, compared to the consensus estimate of $771.53 million. As a group, analysts forecast that Disco Corp will post 1.07 EPS for the current fiscal year.

Disco Company Profile

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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