BE Semiconductor Industries NV (OTCMKTS:BESIY) Receives Average Rating of “Moderate Buy” from Analysts

Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY) have earned a consensus recommendation of “Moderate Buy” from the nine research firms that are presently covering the firm, Marketbeat Ratings reports. Four equities research analysts have rated the stock with a hold rating and five have given a buy rating to the company.

Several brokerages have commented on BESIY. Zacks Research lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, June 26th. Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Finally, Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th.

BE Semiconductor Industries Price Performance

Shares of OTCMKTS BESIY opened at $260.74 on Friday. BE Semiconductor Industries has a 52 week low of $122.81 and a 52 week high of $374.33. The business’s 50 day moving average price is $315.30 and its 200 day moving average price is $257.89. The company has a quick ratio of 4.17, a current ratio of 4.74 and a debt-to-equity ratio of 1.11. The firm has a market cap of $18.91 billion, a P/E ratio of 117.98 and a beta of 1.97.

BE Semiconductor Industries (OTCMKTS:BESIY) last issued its earnings results on Thursday, July 23rd. The technology company reported $1.29 EPS for the quarter, missing analysts’ consensus estimates of $1.30 by ($0.01). BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%. On average, sell-side analysts expect that BE Semiconductor Industries will post 4.45 earnings per share for the current year.

About BE Semiconductor Industries

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.