Disco (OTCMKTS:DSCSY) Shares Gap Down – Should You Sell?

Shares of Disco Corp (OTCMKTS:DSCSY) gapped down prior to trading on Wednesday . The stock had previously closed at $41.10, but opened at $39.00. Disco shares last traded at $38.57, with a volume of 4,203 shares.

Analysts Set New Price Targets

A number of equities analysts recently issued reports on the stock. Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. Jefferies Financial Group upgraded shares of Disco from a “hold” rating to a “buy” rating in a research report on Monday, July 27th. One research analyst has rated the stock with a Buy rating and one has given a Hold rating to the company. According to data from MarketBeat.com, Disco has an average rating of “Moderate Buy”.

Disco Trading Up 0.6%

The stock’s 50 day moving average is $43.72 and its two-hundred day moving average is $44.21. The stock has a market capitalization of $41.09 billion, a price-to-earnings ratio of 43.53 and a beta of 1.55.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share for the quarter. The company had revenue of $717.28 million during the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%. On average, research analysts anticipate that Disco Corp will post 1.05 earnings per share for the current year.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.