BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) was up 7.1% on Friday. The company traded as high as $232.14 and last traded at $232.08. Approximately 1,187 shares traded hands during mid-day trading, a decline of 87% from the average daily volume of 8,970 shares. The stock had previously closed at $216.69.
Analyst Ratings Changes
BESIY has been the subject of several analyst reports. Zacks Research lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, September 25th. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, September 8th. Finally, Berenberg Bank raised BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research note on Tuesday, August 4th. One equities research analyst has rated the stock with a Strong Buy rating, five have given a Buy rating and three have given a Hold rating to the company’s stock. Based on data from MarketBeat.com, BE Semiconductor Industries has an average rating of “Moderate Buy”.
Get Our Latest Research Report on BESIY
BE Semiconductor Industries Stock Up 6.1%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last posted its quarterly earnings data on Thursday, July 23rd. The technology company reported $1.29 earnings per share for the quarter, missing the consensus estimate of $1.30 by ($0.01). BE Semiconductor Industries had a return on equity of 46.44% and a net margin of 28.42%.The firm had revenue of $290.52 million for the quarter, compared to analyst estimates of $285.58 million. On average, sell-side analysts expect that BE Semiconductor Industries NV will post 4.83 earnings per share for the current year.
About BE Semiconductor Industries
BE Semiconductor Industries N.V. (Besi) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to assemble, package, and finish semiconductor devices after wafer fabrication.
Besi’s product portfolio includes die-attach equipment, packaging systems, molding and singulation equipment, plating systems, and related solutions for advanced semiconductor packaging. Its technologies support applications such as flip-chip, wafer-level packaging, thermo-compression bonding, and hybrid bonding, which are used in electronics, communications, automotive, computing, and other semiconductor markets.
Founded in 1995 and headquartered in Duiven, the Netherlands, Besi serves semiconductor manufacturers and assembly and test providers worldwide.
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