SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) Declares Dividend Increase – $0.15 Per Share

SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) announced a monthly dividend on Tuesday, November 3rd. Investors of record on Wednesday, November 4th will be given a dividend of $0.1535 per share on Thursday, November 5th. This represents a $1.84 annualized dividend and a yield of 7.6%. The ex-dividend date is Wednesday, November 4th. This is a 14.3% increase from SEI High Yield Bond & Alternative Credit ETF’s previous monthly dividend of $0.1343.

SEI High Yield Bond & Alternative Credit ETF Stock Down 0.2%

NASDAQ LEND traded down $0.04 on Wednesday, reaching $24.14. The stock had a trading volume of 54,989 shares, compared to its average volume of 73,619. SEI High Yield Bond & Alternative Credit ETF has a 12-month low of $23.95 and a 12-month high of $25.29. The stock has a fifty day moving average price of $24.41 and a two-hundred day moving average price of $21.29.