BE Semiconductor Industries (OTCMKTS:BESIY) Stock Price Crosses Above Two Hundred Day Moving Average – Time to Sell?

BE Semiconductor Industries NV (OTCMKTS:BESIY)’s share price passed above its 200-day moving average during trading on Thursday . The stock has a 200-day moving average of $168.38 and traded as high as $225.0150. BE Semiconductor Industries shares last traded at $218.00, with a volume of 7,451 shares trading hands.

Wall Street Analysts Forecast Growth

BESIY has been the topic of several recent analyst reports. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Needham & Company LLC raised BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Sanford C. Bernstein reaffirmed an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Finally, Kepler Capital Markets cut shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, January 9th. Five equities research analysts have rated the stock with a Buy rating and six have assigned a Hold rating to the company’s stock. Based on data from MarketBeat.com, BE Semiconductor Industries presently has an average rating of “Hold”.

BE Semiconductor Industries Stock Performance

The stock has a fifty day moving average of $198.83 and a 200-day moving average of $168.38. The company has a quick ratio of 5.02, a current ratio of 5.75 and a debt-to-equity ratio of 1.46.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.