Disco Corp (OTCMKTS:DSCSY) Sees Significant Decrease in Short Interest

Disco Corp (OTCMKTS:DSCSY) was the target of a large drop in short interest in the month of July. As of July 15th, there was short interest totaling 10,600 shares, a drop of 90.9% from the June 30th total of 115,925 shares. Currently, 0.0% of the shares of the stock are short sold. Based on an average daily trading volume, of 720,554 shares, the days-to-cover ratio is presently 0.0 days.

Disco Stock Down 6.1%

Shares of OTCMKTS DSCSY traded down $2.38 during midday trading on Friday, hitting $36.37. The company had a trading volume of 187,313 shares, compared to its average volume of 410,191. Disco has a twelve month low of $24.94 and a twelve month high of $58.00. The business has a 50-day simple moving average of $45.07 and a two-hundred day simple moving average of $44.26. The firm has a market capitalization of $39.46 billion, a price-to-earnings ratio of 41.81 and a beta of 1.50.

Disco (OTCMKTS:DSCSY) last released its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 EPS for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.08%. The firm had revenue of $717.28 million for the quarter. On average, equities analysts forecast that Disco will post 1.05 EPS for the current year.

Analyst Upgrades and Downgrades

Separately, Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One research analyst has rated the stock with a Hold rating, Based on data from MarketBeat.com, the company currently has an average rating of “Hold”.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.